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High-Speed LDPC Decoders Towards 1 Tb/s.

Authors :
Li, Meng
Derudder, Veerle
Bertrand, Kaoutar
Desset, Claude
Bourdoux, Andre
Source :
IEEE Transactions on Circuits & Systems. Part I: Regular Papers. May2021, Vol. 68 Issue 5, p2224-2233. 10p.
Publication Year :
2021

Abstract

Beyond 5G systems are expected to approach 1 Tb/s throughput. This poses a significant challenge to the channel decoder. In this paper, we propose a multi-core architecture based on full row parallel layered LDPC decoder with frame interleaving. Compared with conventional partially parallel layered architectures, the proposed architecture increases the throughput by applying frame interleaving into the pipeline architecture and by using multi-core architectures. Two high rate medium size QC LDPC codes are designed with fast decoding convergence speed for this architecture. Both codes are implemented with single core and multi-core architectures to explore different trade-offs between code design, communication performance and implementation. The four decoders are implemented in 16 nm CMOS FinFET technology with a clock rate of 1 GHz. The placement and routing implementation results show that the single core decoder for the LDPC (1027, 856) code is able to provide 114 Gb/s throughput at maximum 3 iterations with an area of 0.173 mm2 and energy efficiency of 1.56 pJ/bit; the multi-core decoder for the (1032, 860) code is able to provide 860 Gb/s throughput at maximum 2 iterations with an area of 1.48 mm2 and energy efficiency of 3.24 pJ/bit. The multi-core decoder achieves the highest throughput in the literature for medium size (1–2k) LDPC codes. When compared with other state-of-the-art fully parallel high speed architectures, the proposed architectures bring a significant gain both in area efficiency and energy efficiency while keeping the ability to offer flexibility in code rate, number of iterations and early stop. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
15498328
Volume :
68
Issue :
5
Database :
Academic Search Index
Journal :
IEEE Transactions on Circuits & Systems. Part I: Regular Papers
Publication Type :
Periodical
Accession number :
149962505
Full Text :
https://doi.org/10.1109/TCSI.2021.3060880