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Online Condition Monitoring for Bond Wire Degradation of IGBT Modules in Three-Level Neutral-Point-Clamped Converters.

Authors :
Wang, Xulong
Sun, Pengju
Sun, Lin
Luo, Quanming
Du, Xiong
Source :
IEEE Transactions on Industrial Electronics. Aug2021, Vol. 68 Issue 8, p7474-7484. 11p.
Publication Year :
2021

Abstract

In this article, an online condition monitoring (CM) method is proposed for the bond wire degradation of insulated-gate bipolar transistor (IGBT) modules in a single-phase or three-phase three-level neutral-point-clamped (3LNPC) dc–ac, ac–dc converter. The proposed method has the ability to detect the whole IGBTs in a 3LNPC converter, based on finding the idle on-state IGBTs under the specific load current direction and switching sequence of a leg. The detection time is short (0.2 ms) and the influence of online CM on load current can be completely neglected as long as the insertion areas for CM test are chosen reasonably. Meanwhile, an advanced bond wire CM module is designed to conduct the CM test. This module can generate and inject the current pulse trains into IGBT modules, with the high current for CM test and low current for temperature-sensitive electrical parameter measurement, and sample the collector–emitter on-state voltage (VCE ON) stably and precisely. Finally, the experimental work was carried out to verify the effectiveness of the proposed method and the practicality of the developed CM module. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
02780046
Volume :
68
Issue :
8
Database :
Academic Search Index
Journal :
IEEE Transactions on Industrial Electronics
Publication Type :
Academic Journal
Accession number :
150190215
Full Text :
https://doi.org/10.1109/TIE.2020.3005073