Modeling of the removal mechanism of monocrystalline silicon-based on phase change-dislocation theory and its edge chipping damage during micro-grinding.

The micro-grinding of complex meso/micro-components of hard and brittle materials have attracted much attention in recent years. However, little related knowledge was accumulated, and there is a lack of quantitative evaluation of edge chipping damage, which is a major drawback. A theoretical model was established to further analyze the material removal mechanism under the action of single grain, considering the pressure phase transition, dislocation nucleation, and crack growth. An evaluation factor Fr of edge chipping damage was proposed to provide a reference for evaluating micro-grinding quality. Besides, the theoretical results were verified using the nano-scratch test. The experimental results proved that the proposed evaluation factor was an efficient tool to describe and predict micro-grinding quality. [Display omitted] • The micro-grinding mechanism of silicon was analyzed through scratching experiment. • The model was established based on phase transformation-dislocation theory. • The evaluation factor was proposed to determine the edge chipping damage. • The micro-grinding process was optimized through the evaluation factor. [ABSTRACT FROM AUTHOR]