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Simulation of high-speed interconnects in a multilayered medium in the presence of incident field.

Authors :
Erdin, Ihsan
Khazaka, Roni
Source :
IEEE Transactions on Microwave Theory & Techniques. Dec98 Part 2 of 2, Vol. 46 Issue 12, p2251. 7p. 3 Black and White Photographs, 1 Diagram, 10 Graphs.
Publication Year :
1998

Abstract

Focuses on the simulation of high-speed microwave circuits and interconnects in the presence of incident electromagnetic interference. Analysis of incident field coupling in inhomogeneous medium; Derivation the interconnect simulation stamp; Transmission line equations with incident field excitation.

Details

Language :
English
ISSN :
00189480
Volume :
46
Issue :
12
Database :
Academic Search Index
Journal :
IEEE Transactions on Microwave Theory & Techniques
Publication Type :
Academic Journal
Accession number :
1509491
Full Text :
https://doi.org/10.1109/22.739206