3D characterization of microstructural evolution and variant selection in additively manufactured Ti-6Al-4 V.

Ti-6Al-4 V is a popular alloy in additive manufacturing (AM) due to its applications in the biomedical implants and aerospace industries where the complex part geometries allowed by AM provide cost and performance benefits. Ti-6Al-4 V goes through a β → α' transformation after solidification which is known to experience variant selection, e.g., through the formation of clusters of variants which, when situated together, partially accommodate the strain of the phase transformation. During electron beam powder bed fusion AM, an in situ decomposition of α' martensite occurs during the cyclic reheating caused by melting successive layers, resulting in α + β microstructures. How variant selection influences the evolution beyond the initial rapid cooling remains an open question. Using 3D electron backscatter diffraction, we provide a clearer understanding without ambiguity from sectioning effects of how α' decomposes into microstructures with distinct morphologies and variant/intervariant distributions. We extract quantitative 3D information on the various intervariant boundaries networks formed in samples printed using three different electron beam scanning strategies. This shows that differing mechanisms during the decomposition result in a shift from self-accommodating clusters in an acicular microstructure, to either the preferred growth of six variants in a basketweave microstructure, or to a colony microstructure where variant selection is determined by prior-β grain boundaries. We propose a new representation of the misorientations arising from the Burgers orientation relationship, which we refer to as intervariant network diagram, to reveal how variant selection during the martensitic transformation and subsequent decomposition leads to the intervariant boundary networks observed. This holistic understanding of the microstructural evolution has the potential to allow tailoring of microstructures and properties for specific applications. [ABSTRACT FROM AUTHOR]