TSV-Cluster Defect Tolerance Using Tree-Based Redundancy for Yield Improvement of 3-D ICs.

Through silicon via (TSV)-based 3-D integrated circuit (3-D IC) has several advantages like high density, high bandwidth, and low-power consumption. However, many defects in TSV are evolved during the fabrication and bonding process. In practice, faulty TSVs tend to be clustered. Employing spare TSVs (s-TSVs) is an acceptable method for repairing faulty TSVs. This article introduces a tree-based TSV repair framework to utilize hardware resources more efficiently for a higher repair rate. The proposed architecture partitions the s-TSVs for a different level of redundancy sharing. Experimental results show that the proposed design consumes 11.01 μ m2 area per signal TSV to achieve 99.99% yield for 0.05% failure rate. The proposed architecture also exhibits a higher repair rate of 73.33% for heavily clustered faults. Moreover, for the same number of functional and s-TSVs, the proposed approach reduces the delay overhead efficiently compared to the prior works. [ABSTRACT FROM AUTHOR]