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A Wideband mmWave Antenna in Fan-Out Wafer Level Packaging With Tall Vertical Interconnects for 5G Wireless Communication.
- Source :
-
IEEE Transactions on Antennas & Propagation . Oct2021, Vol. 69 Issue 10, p6906-6911. 6p. - Publication Year :
- 2021
-
Abstract
- A novel fan-out wafer-level packaging (FOWLP) technology with double-sided redistribution layers (RDLs) and tall copper vertical interconnects is described. The design of a dual-polarized magnetoelectric (ME) dipole antenna based on this new packaging technology is presented. It is shown that the antenna with a size of $10\times10$ mm2 achieves good impedance matching and a stable radiation pattern over a wide bandwidth from 25 to 43 GHz, which can cover most of the millimeter-wave (mmWave) bands of the fifth-generation (5G) mobile networks in different countries. The measurement results demonstrate that the antenna is well suited for FOWLP technology and can be used for phased-array modules in 5G wireless communication systems. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 0018926X
- Volume :
- 69
- Issue :
- 10
- Database :
- Academic Search Index
- Journal :
- IEEE Transactions on Antennas & Propagation
- Publication Type :
- Academic Journal
- Accession number :
- 153731994
- Full Text :
- https://doi.org/10.1109/TAP.2021.3087859