Cite
Analysis and Optimization on Non-uniformity of Temperature Distribution in Hydrophobic Cycloaliphatic Epoxy Resin Insulators during the Curing Process.
MLA
Liu, Yuhao, et al. “Analysis and Optimization on Non-Uniformity of Temperature Distribution in Hydrophobic Cycloaliphatic Epoxy Resin Insulators during the Curing Process.” IEEE Transactions on Dielectrics & Electrical Insulation, vol. 28, no. 5, Oct. 2021, pp. 1810–18. EBSCOhost, https://doi.org/10.1109/TDEI.2021.009668.
APA
Liu, Y., Lin, Y., Wu, K., Fan, H., & Wang, L. (2021). Analysis and Optimization on Non-uniformity of Temperature Distribution in Hydrophobic Cycloaliphatic Epoxy Resin Insulators during the Curing Process. IEEE Transactions on Dielectrics & Electrical Insulation, 28(5), 1810–1818. https://doi.org/10.1109/TDEI.2021.009668
Chicago
Liu, Yuhao, Ying Lin, Kangning Wu, Haonan Fan, and Liming Wang. 2021. “Analysis and Optimization on Non-Uniformity of Temperature Distribution in Hydrophobic Cycloaliphatic Epoxy Resin Insulators during the Curing Process.” IEEE Transactions on Dielectrics & Electrical Insulation 28 (5): 1810–18. doi:10.1109/TDEI.2021.009668.