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A Scalable HPC-Based Domain Decomposition Method for Multiphysics Modeling of RF Devices.

Authors :
Zhang, Hao-Xuan
Zhan, Qiwei
Huang, Li
Wang, Yin-Da
Wang, Wei-Jie
Qin, Zikang
Zhao, Zhen-Guo
Wang, Da-Wei
Zhou, Hai-Jing
Kang, Kai
Zhou, Liang
Yin, Wen-Yan
Source :
IEEE Transactions on Components, Packaging & Manufacturing Technology. Dec2021, Vol. 11 Issue 12, p2158-2170. 13p.
Publication Year :
2021

Abstract

In this article, a large-scale electromagnetic-thermal-mechanical co-simulation solver is implemented, to simulate complex radio frequency components by using a high performance computing framework. The proposed solver integrates the frequency-domain electric field simulation, with time-domain thermal and thermal-induced stress simulations, via a multiphysics coupling iterative process. In order to speed up the cosimulation, a Krylov subspace method with a domain decomposition method (DDM) preconditioner is used. First, the developed multiphysics solver is verified with the commercial software COMSOL Multiphysics. Then, the parallel performance of our cosimulation solver, with different ghost mesh thicknesses, is tested on a supercomputer. Finally, some multiphysics results of filters and a real-world system-in-package (SiP) are obtained with our proposed solver. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
21563950
Volume :
11
Issue :
12
Database :
Academic Search Index
Journal :
IEEE Transactions on Components, Packaging & Manufacturing Technology
Publication Type :
Academic Journal
Accession number :
154149162
Full Text :
https://doi.org/10.1109/TCPMT.2021.3121540