2021 Index IEEE Transactions on Components, Packaging and Manufacturing Technology Vol. 11.

Subjects

Subjects :

*SEMICONDUCTOR manufacturing
*THERMAL diffusivity
*INTEGRATED circuit design
*SHAPE memory effect
*THROUGH-silicon via
*HIGH temperature electronics
*THREE-dimensional integrated circuits

Details

Language :

English

ISSN :

21563950

Volume :

11

Issue :

12

Database :

Academic Search Index

Journal :

IEEE Transactions on Components, Packaging & Manufacturing Technology

Publication Type :

Academic Journal

Accession number :

154149175

Full Text :

https://doi.org/10.1109/TCPMT.2021.3135745