Cite
Concerted Wire Lifting: Enabling Secure and Cost-Effective Split Manufacturing.
MLA
Patnaik, Satwik, et al. “Concerted Wire Lifting: Enabling Secure and Cost-Effective Split Manufacturing.” IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems, vol. 41, no. 2, Feb. 2022, pp. 266–80. EBSCOhost, https://doi.org/10.1109/TCAD.2021.3056379.
APA
Patnaik, S., Ashraf, M., Li, H., Knechtel, J., & Sinanoglu, O. (2022). Concerted Wire Lifting: Enabling Secure and Cost-Effective Split Manufacturing. IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems, 41(2), 266–280. https://doi.org/10.1109/TCAD.2021.3056379
Chicago
Patnaik, Satwik, Mohammed Ashraf, Haocheng Li, Johann Knechtel, and Ozgur Sinanoglu. 2022. “Concerted Wire Lifting: Enabling Secure and Cost-Effective Split Manufacturing.” IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems 41 (2): 266–80. doi:10.1109/TCAD.2021.3056379.