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In situ X-ray analysis of solid/electrolyte interfaces: electrodeposition of Cu and Co on Si(111):H and GaAs(001) and corrosion of Cu3Au(111)

Authors :
Zegenhagen, J.
Renner, F.U.
Reitzle, A.
Lee, T.L.
Warren, S.
Stierle, A.
Dosch, H.
Scherb, G.
Fimland, B.O.
Kolb, D.M.
Source :
Surface Science. Dec2004, Vol. 573 Issue 1, p67-79. 13p.
Publication Year :
2004

Abstract

Abstract: Electrochemical deposition of Cu and Co in monolayer amounts on hydrogen terminated Si(111) was studied ex situ and in situ by X-ray techniques. The X-ray beam was found to have a strong effect on the deposit causing desorption under the beam. Cu deposition on GaAs(001) from UHV is compared with electrodeposited Cu on the same surface, elucidating similarities and differences of electrochemical and UHV deposition. Roughening due to corrosion of Cu3Au(111) is observed by crystal truncation scattering. The observed behaviour of passivation of this surface is explained by the formation of Au clusters, increasingly covering the surface at higher oxidation potential. [Copyright &y& Elsevier]

Details

Language :
English
ISSN :
00396028
Volume :
573
Issue :
1
Database :
Academic Search Index
Journal :
Surface Science
Publication Type :
Academic Journal
Accession number :
15552154
Full Text :
https://doi.org/10.1016/j.susc.2004.05.145