Modeling and analysis of a thermoviscoelastic rotating micro-scale beam under pulsed laser heat supply using multiple models of thermoelasticity.

In recent decades, microelectromechanical system (MEMS) technology has aroused great interest from researchers in the fields of science and technology, electromechanics, chemistry, and bioengineering. Rotary systems are also used in a variety of sectors, from a space station with a spinning wheel to a small turbine in smartphones. In this paper, the thermoviscoelastic interactions of rotating microbeams were investigated using the modified couple stress theory (MCST) to examine the size-dependent effect. Also, the governing equations were derived within the framework of the Lord and Shulman generalized thermoelastic theory and the Euler–Bernoulli beam model. In addition, the Kelvin–Voigt approach is used to calculate the properties of viscoelastic materials. By applying the proposed model, an axially compressed microbeam that rotates at a constant angular velocity and is exposed to a femtosecond laser pulsed heat source was studied To solve the equations of motion in the space domain, the well-known Laplace transform technique is utilized. The inverse Laplace transform is calculated numerically using a well-established and reliable approximation approach. The effect of the length scale parameter, laser pulse duration, and angular velocity on the heat and elastic waves of a rotating thin beam is explored and discussed. The effect of the viscous damping factor on different physical fields of the microbeam was also studied. • The thermoviscoelastic interactions of rotating microbeams based on the modified couple stress theory are studied. • The governing equations are derived based on generalized thermoelasticity and Euler–Bernoulli beam theories. • This microbeam is axially compressed and rotated at a consistent angular speed and subjected to a heat source. • The influence of the effective parameters on the thermal and mechanical waves was depicted and explored in depth. [ABSTRACT FROM AUTHOR]