Preparation of graphene/copper composites with a thiophenol molecular junction for thermal conduction application.

MLA

Li, Xiaofang, et al. “Preparation of Graphene/Copper Composites with a Thiophenol Molecular Junction for Thermal Conduction Application.” New Journal of Chemistry, vol. 46, no. 21, June 2022, pp. 10107–16. EBSCOhost, https://doi.org/10.1039/d2nj00374k.

APA

Li, X., Miu, J., An, M., Mei, J., Zheng, F., Jiang, J., Wang, H., Huang, Y., & Li, Q. (2022). Preparation of graphene/copper composites with a thiophenol molecular junction for thermal conduction application. New Journal of Chemistry, 46(21), 10107–10116. https://doi.org/10.1039/d2nj00374k

Chicago

Li, Xiaofang, Jianwen Miu, Meng An, Jing Mei, Fenghua Zheng, Juantao Jiang, Hongqiang Wang, Youguo Huang, and Qingyu Li. 2022. “Preparation of Graphene/Copper Composites with a Thiophenol Molecular Junction for Thermal Conduction Application.” New Journal of Chemistry 46 (21): 10107–16. doi:10.1039/d2nj00374k.