Numerical analysis of nozzle shape effect on fluid motion in LPCVD batch-type furnace.

The importance of equipment technology for semiconductor mass production is growing as well as the exponential increase in demand for semiconductors. A study was conducted to improve the flow condition of a low-pressure chemical vapor deposition (LPCVD) batch-type furnace. Convergent nozzle (C) and divergent nozzle (D) have been adopted to replace the current straight (ST) multi-nozzle system, which was analyzed hydrodynamically without considering the surface chemical reaction. From the result, the D nozzle was not suitable for application due to induced flow oscillation. The flow velocity on the edge of the wafer increased 3.03 % for the C nozzle. In addition, the mass flux was enhanced up to 3 times and the mass flow rate 11.49 % at 3 sections. Therefore, it was expected that the deposition performance of the LPCVD furnace would be improved by the enhanced convective flow when the C nozzle was applied to the multi-nozzle system. [ABSTRACT FROM AUTHOR]