Improvement in radiation resistance of nanocrystalline Cu using grain boundary engineering: an atomistic simulation study.

MLA

Manna, Mouparna, and Snehanshu Pal. “Improvement in Radiation Resistance of Nanocrystalline Cu Using Grain Boundary Engineering: An Atomistic Simulation Study.” Journal of Materials Science, vol. 57, no. 42, Nov. 2022, pp. 19832–45. EBSCOhost, https://doi.org/10.1007/s10853-022-07877-3.

APA

Manna, M., & Pal, S. (2022). Improvement in radiation resistance of nanocrystalline Cu using grain boundary engineering: an atomistic simulation study. Journal of Materials Science, 57(42), 19832–19845. https://doi.org/10.1007/s10853-022-07877-3

Chicago

Manna, Mouparna, and Snehanshu Pal. 2022. “Improvement in Radiation Resistance of Nanocrystalline Cu Using Grain Boundary Engineering: An Atomistic Simulation Study.” Journal of Materials Science 57 (42): 19832–45. doi:10.1007/s10853-022-07877-3.