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Intrinsic ionic confinement dynamic engineering of ionomers with low dielectric-k, high healing and stretchability for electronic device reconfiguration.

Authors :
Wang, Jingwen
Zheng, Yapeng
Ren, Wei
Ang, Edison Huixiang
Song, Lei
Zhu, Jixin
Hu, Yuan
Source :
Chemical Engineering Journal. Feb2023:Part 1, Vol. 453, pN.PAG-N.PAG. 1p.
Publication Year :
2023

Abstract

• An ionic confinement engineering approach is proposed to facilitate dynamic ionic crosslinking. • The ionomers deliver low dielectric-k property, high stretchability and fast self-healing capability. • The EGaIn-infused stretchable device is designed for electronic device reconfiguration. Ionomers are gaining much attention in the fields of soft robots, flexible electronics, and artificial intelligence. However, intrinsic dynamics modulation of ionomer molecules to achieve desirable properties is highly required and challenging due to a lack of understanding of the interactions between polymerics and ionic species. In this study, a novel ionic confinement engineering approach was employed, in which the composition of a copolymer, namely, PTAE-Fe, was adjusted to facilitate dynamic ionic crosslinking, which enables high stretchability (>10000 % elongation). The proportion of ionic functional groups in PTAE-Fe significantly enhanced the self-healing efficiency up to 95 %. The ionic confinement strategy also promotes electron momentum locking, resulting in a low dielectric-k property (D k < 2.5), while a reduction in the heat release rate of 69.1 % makes the ionomer an excellent flame retardant material. In addition, a eutectic gallium-indium (EGaIn)-infused stretchable device and low D k flexible ink were designed according to the ionic confinement strategy. The as-fabricated ionomer is expected to benefit a wide range of energy and storage technologies. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
13858947
Volume :
453
Database :
Academic Search Index
Journal :
Chemical Engineering Journal
Publication Type :
Academic Journal
Accession number :
160237403
Full Text :
https://doi.org/10.1016/j.cej.2022.139837