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Photosensitive Si3N4 slurry with combined benefits of low viscosity and large cured depth for digital light processing 3D printing.
- Source :
-
Journal of the European Ceramic Society . Mar2023, Vol. 43 Issue 3, p881-888. 8p. - Publication Year :
- 2023
-
Abstract
- Digital light processing 3D printing can be applied to fabricate complex silicon nitride (Si 3 N 4) components. However, because of the surface hydroxyl groups and large refractive index, it is still a foremost challenge to realize a stable photosensitive Si 3 N 4 slurry with combined benefits of low viscosity and large curing depth. In this study, we propose a new formulation strategy to prepare Si 3 N 4 slurry. Starting from the optimization of monomer ratio, we have systematically optimized powder particle size, dispersant and photoinitiator on the rheological properties and curing properties of Si 3 N 4 slurry. Specifically, we have fabricated a stable photosensitive Si 3 N 4 slurry (48 vol%) with a viscosity of 2.09 Pa s (30 s−1), a critical curing energy of 126.09 mJ/cm2 and a maximum curing depth of 80 µm. Finally, based on this optimized slurry, we have successfully obtained complex Si 3 N 4 green body with no defect, which demonstrates great potential to fabricate arbitrary complex ceramic components for various applications. [ABSTRACT FROM AUTHOR]
- Subjects :
- *THREE-dimensional printing
*SLURRY
*VISCOSITY
*SILICON nitride
*RHEOLOGY
Subjects
Details
- Language :
- English
- ISSN :
- 09552219
- Volume :
- 43
- Issue :
- 3
- Database :
- Academic Search Index
- Journal :
- Journal of the European Ceramic Society
- Publication Type :
- Academic Journal
- Accession number :
- 160442712
- Full Text :
- https://doi.org/10.1016/j.jeurceramsoc.2022.10.056