Design of 3-D Integrated SIW Multiband Bandpass Filter With Split-Type Extended Doublet Topology.

MLA

Zhou, Xin, et al. “Design of 3-D Integrated SIW Multiband Bandpass Filter With Split-Type Extended Doublet Topology.” IEEE Transactions on Components, Packaging & Manufacturing Technology, vol. 12, no. 10, Oct. 2022, pp. 1681–91. EBSCOhost, https://doi.org/10.1109/TCPMT.2022.3215446.

APA

Zhou, X., Zhang, G., Feng, S., Tam, K. W., Zhang, Z., Tang, W., & Yang, J. (2022). Design of 3-D Integrated SIW Multiband Bandpass Filter With Split-Type Extended Doublet Topology. IEEE Transactions on Components, Packaging & Manufacturing Technology, 12(10), 1681–1691. https://doi.org/10.1109/TCPMT.2022.3215446

Chicago

Zhou, Xin, Gang Zhang, Shuai Feng, Kam Weng Tam, Zhuowei Zhang, Wanchun Tang, and Jiquan Yang. 2022. “Design of 3-D Integrated SIW Multiband Bandpass Filter With Split-Type Extended Doublet Topology.” IEEE Transactions on Components, Packaging & Manufacturing Technology 12 (10): 1681–91. doi:10.1109/TCPMT.2022.3215446.