Temperature-related tensile modulus of polymer-based adhesive films.

Most engineered wood components and their performance are dependent on the use of adhesives. To be able to conduct simulations, a general understanding about their mechanical behaviour under different load cases and environmental conditions is needed. Especially the temperature-dependent elasticity is of great importance for future applications as automotive components. Therefore, the tensile modulus of four common polymer-based wood adhesives (i.e., one-component polyurethane, two-component polyurethane, epoxy-silan and phenol–resorcinol–formaldehyde) at varying temperatures of −30°C, +20°C and +80°C were investigated. The aim of this study was to give fundamental insight into the elasto-mechanical behaviour of common wood adhesives. The experimental investigation showed a significant influence of the temperature on the tensile modulus. The highest tensile moduli were observed for all tested adhesives at −30°C with a significant decrease with increasing temperature. Results of previous investigations confirmed this high-temperature dependency of the polymers. [ABSTRACT FROM AUTHOR]