Cite
Research on the influence mechanism and modification technology of UV-curing adhesive on the HPLD thermal-induced misalignment.
MLA
Yan, Yixiong, et al. “Research on the Influence Mechanism and Modification Technology of UV-Curing Adhesive on the HPLD Thermal-Induced Misalignment.” International Journal of Adhesion & Adhesives, vol. 121, Jan. 2023, p. N.PAG. EBSCOhost, https://doi.org/10.1016/j.ijadhadh.2022.103320.
APA
Yan, Y., Zheng, Y., Duan, J., Chen, S., & Chen, X. (2023). Research on the influence mechanism and modification technology of UV-curing adhesive on the HPLD thermal-induced misalignment. International Journal of Adhesion & Adhesives, 121, N.PAG. https://doi.org/10.1016/j.ijadhadh.2022.103320
Chicago
Yan, Yixiong, Yu Zheng, Ji’an Duan, Shu-han Chen, and Xiao-min Chen. 2023. “Research on the Influence Mechanism and Modification Technology of UV-Curing Adhesive on the HPLD Thermal-Induced Misalignment.” International Journal of Adhesion & Adhesives 121 (January): N.PAG. doi:10.1016/j.ijadhadh.2022.103320.