Back to Search Start Over

Assessment of milling condition by image processing of the produced surfaces.

Authors :
Carbone, Nicolas
Bernini, Luca
Albertelli, Paolo
Monno, Michele
Source :
International Journal of Advanced Manufacturing Technology. 1/15/2023, Vol. 124 Issue 5/6, p1681-1697. 17p. 5 Color Photographs, 2 Black and White Photographs, 2 Diagrams, 9 Charts, 4 Graphs.
Publication Year :
2023

Abstract

The digital industrial revolution calls for smart manufacturing plants, i.e. plants that include sensors and vision systems accompanied with artificial intelligence and advanced data analytics in order to meet the required accuracy, reliability and productivity levels. In this paper, we introduce a surface analysis and classification approach based on a deep learning algorithm. The approach is intended to let machining centres recognise the adequacy of process parameters adopted for the milling operation performed, based on the phenomenological effects left on the machined surface. Indeed, the operator will be able to understand how to change process parameters to improve workpiece quality of subsequent parts by a reverse engineering procedure that reconstructs the process parameters that generated the analysed surface. A shallow convolutional neural network was proposed to work on surface image patches based on a limited training dataset of optimal and undesired cutting conditions. The architecture consists of a series of 3 stacked convolutional blocks. The performance of the proposed solution was validated through 5-fold cross-validation, measuring the mean and standard deviation of the f1-score metric. The algorithm arrived at outperformed the best state-of-the-art approach by 4.8% when considering average classification performance. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
02683768
Volume :
124
Issue :
5/6
Database :
Academic Search Index
Journal :
International Journal of Advanced Manufacturing Technology
Publication Type :
Academic Journal
Accession number :
161191587
Full Text :
https://doi.org/10.1007/s00170-022-10516-5