Study on micro-grinding mechanism and surface and subsurface quality of 20 vol% SiCp/Al composites.

A finite element model of single abrasive grinding was established to analyze the material removal during the grinding process and analyze the surface and subsurface defects of the material after grinding. Using the orthogonal test method to machine the surface of the workpiece with a grinding rod of 2 mm grinding head diameter, and to investigate the influence degree of the machining parameters on the roughness. It was concluded that the grinding depth has the most significant effect on surface roughness, followed by the spindle speed and the feed speed, and the minimum roughness of the ground surface obtained was 0.066 µm. The rough surface was simulated by the digital filtering method based on fast Fourier transform (FFT), and the morphological characteristics of the rough surface at Ra = 0.116 µm were described, and the simulated surface was consistent with the detected surface. The laser scanning confocal microscope (LSCM) and scanning electron microscope (SEM) were used for inspection, and the analysis showed that the main removal forms of the enhanced particles were broken, fractured, and pulled out. The surface defects were cracks, pits, and burrs, and the subsurface damages were voids, cracks, and pits. [ABSTRACT FROM AUTHOR]