Numerical simulation of heat sinks with different configurations for high power LED thermal management.

This study performed a steady-statenumerical analysis to understand the temperature in different heat sink configurations forLEDapplications. Seven heat sink configurationsnamed R, H-6, H-8, H-10,C,C3, and C3E3 were considered. Parameters like input power, number of fins, heat sink configuration were varied, and their influence on LED temperature distribution, heat sink thermal resistance and thermal interface material temperature were studied. The results showed that the temperature distribution of the H-6 heat sink decreased by 46.30%compared with theCheat sink for aninput power of 16W. The result of theH-6 heat sink shows that the heat sink thermal resistance was decreased by 73.91% compared with the Cheat sink at 16W. The lowest interface material temperature of 54.11 °C was achieved by the H-6 heat sink when the input power was used 16W. The H-6 heat sink exhibited better performance due to more surface area with several fins than other heat sinks. [ABSTRACT FROM AUTHOR]