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MAKING CONNECTIONS: CHALLENGES AND OPPORTUNITIES FOR IN SITU TEM BIASING.

Authors :
Hubbard, William A.
Source :
Electronic Device Failure Analysis. Feb2023, Vol. 25 Issue 1, p4-8. 5p.
Publication Year :
2023

Abstract

The article discusses challenges and strategies for producing transmission electron microscopy (TEM)-compatible and electronically viable electronic devices. Topics include the sample preparation process using the Focused ion beam (FIB) technique to create cross-sectioned samples; and highlights the potential of scanning TEM electron beam-induced current as a complement to standard TEM imaging with benefits of high-throughput sample fabrication.

Details

Language :
English
ISSN :
15370755
Volume :
25
Issue :
1
Database :
Academic Search Index
Journal :
Electronic Device Failure Analysis
Publication Type :
Academic Journal
Accession number :
161634343
Full Text :
https://doi.org/10.31399/asm.edfa.2023-1.p004