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MAKING CONNECTIONS: CHALLENGES AND OPPORTUNITIES FOR IN SITU TEM BIASING.
- Source :
-
Electronic Device Failure Analysis . Feb2023, Vol. 25 Issue 1, p4-8. 5p. - Publication Year :
- 2023
-
Abstract
- The article discusses challenges and strategies for producing transmission electron microscopy (TEM)-compatible and electronically viable electronic devices. Topics include the sample preparation process using the Focused ion beam (FIB) technique to create cross-sectioned samples; and highlights the potential of scanning TEM electron beam-induced current as a complement to standard TEM imaging with benefits of high-throughput sample fabrication.
Details
- Language :
- English
- ISSN :
- 15370755
- Volume :
- 25
- Issue :
- 1
- Database :
- Academic Search Index
- Journal :
- Electronic Device Failure Analysis
- Publication Type :
- Academic Journal
- Accession number :
- 161634343
- Full Text :
- https://doi.org/10.31399/asm.edfa.2023-1.p004