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Analysis of Staggered-Via Loss in Substrate Integrated Waveguide.
- Source :
-
IETE Journal of Research . Jan2023, Vol. 69 Issue 1, p203-208. 6p. - Publication Year :
- 2023
-
Abstract
- In this paper, loss due to staggered-via in SIW (Substrate Integrated Waveguide) is analyzed with the help of S-parameter responses and field diagrams. It is observed that staggered-via improves the response of an SIW structure, with higher via pitch (w) to via diameter (d) ratio (w/d), but the loss increases drastically at certain discrete frequencies for which λ / 2 n equals to w, where λ is the guided wavelength corresponding to the frequency and n is any integer value excluding zero. This study will be helpful in choosing between the use of single row of vias or staggered-vias as a sidewall, while designing SIWs at higher frequencies, where it is difficult to use conventional w/d ratio values. [ABSTRACT FROM AUTHOR]
- Subjects :
- *MILLIMETER waves
*THEORY of wave motion
*DIELECTRIC loss
*INTEGERS
Subjects
Details
- Language :
- English
- ISSN :
- 03772063
- Volume :
- 69
- Issue :
- 1
- Database :
- Academic Search Index
- Journal :
- IETE Journal of Research
- Publication Type :
- Academic Journal
- Accession number :
- 161831779
- Full Text :
- https://doi.org/10.1080/03772063.2020.1811785