Analysis of Staggered-Via Loss in Substrate Integrated Waveguide.

In this paper, loss due to staggered-via in SIW (Substrate Integrated Waveguide) is analyzed with the help of S-parameter responses and field diagrams. It is observed that staggered-via improves the response of an SIW structure, with higher via pitch (w) to via diameter (d) ratio (w/d), but the loss increases drastically at certain discrete frequencies for which λ / 2 n equals to w, where λ is the guided wavelength corresponding to the frequency and n is any integer value excluding zero. This study will be helpful in choosing between the use of single row of vias or staggered-vias as a sidewall, while designing SIWs at higher frequencies, where it is difficult to use conventional w/d ratio values. [ABSTRACT FROM AUTHOR]