Cite
Grain and Grain Boundary Conduction Channels in Copper Iodide Thin Films.
MLA
Stralka, Tillmann, et al. “Grain and Grain Boundary Conduction Channels in Copper Iodide Thin Films.” Physica Status Solidi. A: Applications & Materials Science, vol. 220, no. 6, Mar. 2023, pp. 1–8. EBSCOhost, https://doi.org/10.1002/pssa.202200883.
APA
Stralka, T., Bar, M., Schöppach, F., Selle, S., Yang, C., von Wenckstern, H., & Grundmann, M. (2023). Grain and Grain Boundary Conduction Channels in Copper Iodide Thin Films. Physica Status Solidi. A: Applications & Materials Science, 220(6), 1–8. https://doi.org/10.1002/pssa.202200883
Chicago
Stralka, Tillmann, Michael Bar, Fabian Schöppach, Susanne Selle, Chang Yang, Holger von Wenckstern, and Marius Grundmann. 2023. “Grain and Grain Boundary Conduction Channels in Copper Iodide Thin Films.” Physica Status Solidi. A: Applications & Materials Science 220 (6): 1–8. doi:10.1002/pssa.202200883.