Cite
Semi-Supervised Learning for Simultaneous Location Detection and Classification of Mixed-Type Defect Patterns in Wafer Bin Maps.
MLA
Lee, Hyuck, et al. “Semi-Supervised Learning for Simultaneous Location Detection and Classification of Mixed-Type Defect Patterns in Wafer Bin Maps.” IEEE Transactions on Semiconductor Manufacturing, vol. 36, no. 2, May 2023, pp. 220–30. EBSCOhost, https://doi.org/10.1109/TSM.2023.3264279.
APA
Lee, H., Lee, J., & Kim, H. (2023). Semi-Supervised Learning for Simultaneous Location Detection and Classification of Mixed-Type Defect Patterns in Wafer Bin Maps. IEEE Transactions on Semiconductor Manufacturing, 36(2), 220–230. https://doi.org/10.1109/TSM.2023.3264279
Chicago
Lee, Hyuck, Jaehyun Lee, and Heeyoung Kim. 2023. “Semi-Supervised Learning for Simultaneous Location Detection and Classification of Mixed-Type Defect Patterns in Wafer Bin Maps.” IEEE Transactions on Semiconductor Manufacturing 36 (2): 220–30. doi:10.1109/TSM.2023.3264279.