Transient thermo-mechanical analysis of a spherical microshell based on the three-phase-lag thermoelasticity incorporating small-scale and memory-dependent effects.

The applicability of the Green–Naghdi (GN-III) thermoelasticity is increasingly questionable because the theory predicts that heat transfers with an infinite speed. To address this deficiency, the three-phase-lag (TPL) thermoelasticity was developed by introducing the lagging times into the GN-III thermoelasticity. On another front, the small-scale effect on elastic deformation cannot be ignored with the miniaturization of structures or devices. Meanwhile, the memory-dependent feature of heat transfer process in the case of ultrafast heating cannot be described by the integer-order heat conduction models due to the inherent local limited definition. To capture the small-scale effect and the memory-dependent effect of the microstructures, as a first attempt, the present work focuses on developing a TPL thermoelastic model by considering the memory-dependent derivative (MDD) heat conduction model and Eringen's nonlocal model. Then, the refined model is used to investigate the transient characteristics of a spherical microshell induced by thermal and mechanical loadings. The governing equations containing the modified parameters are derived and then solved by Laplace transform method. Some parametric results are demonstrated to display the effects of the time-delay factor, the kernel function, and the nonlocal parameter on the considered physical quantities. [ABSTRACT FROM AUTHOR]