Cite
High thermal conductivity insulating AlN/poly(m-phenylenedicarbonyl-m-phenylenediamine) paper realized by enhanced compatibility: a selection of appropriate coupling agent.
MLA
Yang, Rui, et al. “High Thermal Conductivity Insulating AlN/Poly(m-Phenylenedicarbonyl-m-Phenylenediamine) Paper Realized by Enhanced Compatibility: A Selection of Appropriate Coupling Agent.” Journal of Physics D: Applied Physics, vol. 56, no. 44, Nov. 2023, pp. 1–9. EBSCOhost, https://doi.org/10.1088/1361-6463/acea2f.
APA
Yang, R., Ruan, H., Fan, S., Sun, K., Wang, S., Yu, X., & Lü, F. (2023). High thermal conductivity insulating AlN/poly(m-phenylenedicarbonyl-m-phenylenediamine) paper realized by enhanced compatibility: a selection of appropriate coupling agent. Journal of Physics D: Applied Physics, 56(44), 1–9. https://doi.org/10.1088/1361-6463/acea2f
Chicago
Yang, Rui, Hao-ou Ruan, Si-di Fan, Kai-xuan Sun, Sheng-hui Wang, Xiang Yu, and Fang-cheng Lü. 2023. “High Thermal Conductivity Insulating AlN/Poly(m-Phenylenedicarbonyl-m-Phenylenediamine) Paper Realized by Enhanced Compatibility: A Selection of Appropriate Coupling Agent.” Journal of Physics D: Applied Physics 56 (44): 1–9. doi:10.1088/1361-6463/acea2f.