Characterization and dressing effect of CMP diamond disc conditioner with ordered abrasive distribution.

With the advent of the 5G information age, the production and processing of computer chips have attracted people's attention. In order to adapt to the rapid development in the field of chip manufacturing, higher requirements are placed on chemical mechanical planarization (CMP). Due to the porous structure of the polishing pad surface, the polishing pad is prone to clogging and its performance gradually decreases during the polishing process. Therefore, the use of diamond disc conditioner to dress the polishing pad in the CMP process is an indispensable part. In this paper, a new method of measuring the conditioner disc is proposed, the wax is melted and covered on the disc, and after a period of time, it solidifies on the surface of the dressing disc to obtain the protrusion height of the grains; this method has more advantages than measuring with an optical microscope because of the error caused by the diffuse reflection of the microscope. For diamond conditioners used in the experiments, the motion trajectory of abrasive grains is simulated, which is the basis on choosing the experimental method, and the material removal rate model of the polishing pad is established. In addition, after polishing the silicon wafer with a polishing pad for 2 h, the diamond conditioners with orderly distributed abrasive grains are used to dress the pad, the discs can remove the blocking material on the surface of the polishing pad after dressing 30 min, and the dressing effect and efficiency of the diamond disc with grain size of 100 μm are more obvious. The surface roughness and the liquid contact angle of the polishing pad before and after dressing are measured; after a period of conditioning, they can be restored to a state similar to that of the new polishing pad. General scheme of the research [ABSTRACT FROM AUTHOR]