A novel spiral grooved cooling path heat sink for the cooling of high voltage direct current devices.

Devices utilizing high voltage direct current (HVDC) necessitate effective heat dissipation using heat sinks to ensure stable and dependable operation. This paper introduces a novel spiral grooved cooling path heat sink concept, which uses a combination of propylene glycol and water as a coolant. A numerical analysis thoroughly explores how modifications to the cooling path structure can affect fluid dynamics and heat transfer characteristics. A series of simulations are conducted to scrutinize the performance of these innovative geometric modifications according to Friction factor, Nusselt number and Thermal performance factor. The heat sink's performance is also examined in the context of the working fluid's flow rate. Results show that the novel spiral grooved cooling path heat sink design exhibits the best thermal performance compared to a plain cooling path heat sink. Among the spiral grooved cooling path designs, SGCP 2 shows the highest thermal performance factor, indicating higher convective heat transfer rates. The thermal performance factor of SGCP 2 is 2.6–5.0% higher than SGCP 1 and 1.3–1.4% higher than SGCP 3. The proposed numerical approach provides a comprehensive understanding of cooling path configurations for heat sinks used for the purpose of cooling HVDC devices. [Display omitted] • A novel heat sink is presented for the cooling purpose of HVDC devices. • Experimental results are well matched with simulation results. • SGCP heat sinks exhibit higher heat transfer rate as compared to PCP heat sink. • Among SGCP heat sinks, SGCP 2 shows enhanced thermal performance factor. [ABSTRACT FROM AUTHOR]