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Advancing high-performance tailored dual-crosslinking network organo-hydrogel flexible device for wireless wearable sensing.

Authors :
Zheng, Yapeng
Wang, Jingwen
Cui, Tianyang
Zhu, Jixin
Gui, Zhou
Source :
Journal of Colloid & Interface Science. Jan2024:Part A, Vol. 653, p56-66. 11p.
Publication Year :
2024

Abstract

[Display omitted] Conductive hydrogels are essential for enabling long-term and reliable signal sensing in wearable electronics due to their tunable flexibility, stimulus responsiveness, and multimodal sensing integration. However, developing durable and dependable integrated hydrogel-based flexible devices has been challenging due to mismatched mechanical properties, limited water retention capability, and reduced flexibility. This work addresses these challenges by employing a tailored physical–chemical dual-crosslinking strategy to fabricate dynamically reversible organo-hydrogels with high performance. The resultant organo-hydrogels exhibit exceptional characteristics, including high stretchability (up to ∼495% strain), remarkable toughness (with tensile and compressive strengths of ∼1350 kPa and ∼9370 kPa, respectively), and outstanding transparency (∼90.3%). Moreover, they demonstrate excellent long-term water retention ability (>2424 h, >97%). Notably, the organo-hydrogel based sensor exhibits heightened sensitivity for monitoring physiological signals and motions. Furthermore, our integrated wireless wearable sensing system efficiently captures and transmits various human physiological signals and motion information in real-time. This research advances the development of customized devices utilizing functional organo-hydrogel materials, making contributions to fulfilling the increasing demand for high-performance wireless wearable sensing. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
00219797
Volume :
653
Database :
Academic Search Index
Journal :
Journal of Colloid & Interface Science
Publication Type :
Academic Journal
Accession number :
173119026
Full Text :
https://doi.org/10.1016/j.jcis.2023.09.051