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OPTIMIZED METHOD FOR THERMAL THROUGH SILICON VIA PLACEMENT WITH NON-UNIFORM HEAT SOURCES IN 3-D-IC.
- Source :
-
Thermal Science . 2023, Vol. 27 Issue 5A, p3551-3559. 9p. - Publication Year :
- 2023
-
Abstract
- In the past few years, thermal through silicon via (TTSV) has been experimentally investigated as an effective heat dissipation path. Although a lot of heat dissipation- related issues have been solved in 3-D integrated circuit (3-D-IC), there are neglections in TTSV placement with non-uniform heat sources so far. In this study, a unique optimization is proposed to locate TTSV while effectively alleviating hot spots in 3-D-IC. The thermal dissipation of non-uniform heat sources are studied using the finite element method. The simulation results show that the minimum temperature is reduced by 2.1% compared with peak temperature in the single-layer chip, and by 1.9% in the three-layer chip. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 03549836
- Volume :
- 27
- Issue :
- 5A
- Database :
- Academic Search Index
- Journal :
- Thermal Science
- Publication Type :
- Academic Journal
- Accession number :
- 173878754
- Full Text :
- https://doi.org/10.2298/TSCI220801021D