Research progress on passive enhanced heat transfer technology in microchannel heat sink.

• A comprehensive review of the current research status of microchannel heat sinks was conducted from the perspectives of channel configuration, secondary structure, combined structure, and special cooling agents. • An analysis of the heat transfer and flow characteristics of various microchannel heat sinks was conducted. • A comparison of the advantages and disadvantages of various microchannel heat sinks was made. Enhanced heat transfer technology can be divided into active technology and passive technology based on whether external power is consumed. Due to the absence of external energy consumption, passive technology is more reliable than active cooling technology. Microchannel heat sink (MCHS) are widely used for heat dissipation in the field of microelectronics. In recent years, due to the continuous miniaturization of electronic chips and the high heat flux per unit area (about 300 W/cm2), the passive enhanced heat transfer technology of microchannel heat sinks has developed rapidly. This article provides a comprehensive review of passive enhanced heat transfer technology in MCHS. It introduces the influence of channel configuration, secondary structure, combined structure, and different heat transfer media on the heat transfer capacity and pressure drop of microchannel heat sinks. Finally, a summary is given based on the collected data. [ABSTRACT FROM AUTHOR]