Cite
Measuring residual stresses in individual on-chip interconnects using synchrotron nanodiffraction.
MLA
Zhang, Yaqian, et al. “Measuring Residual Stresses in Individual On-Chip Interconnects Using Synchrotron Nanodiffraction.” Applied Physics Letters, vol. 124, no. 8, Feb. 2024, pp. 1–6. EBSCOhost, https://doi.org/10.1063/5.0192672.
APA
Zhang, Y., Du, L., Bäcke, O., Kalbfleisch, S., Zhang, G., Vollebregt, S., & Hörnqvist Colliander, M. (2024). Measuring residual stresses in individual on-chip interconnects using synchrotron nanodiffraction. Applied Physics Letters, 124(8), 1–6. https://doi.org/10.1063/5.0192672
Chicago
Zhang, Yaqian, Leiming Du, Olof Bäcke, Sebastian Kalbfleisch, Guoqi Zhang, Sten Vollebregt, and Magnus Hörnqvist Colliander. 2024. “Measuring Residual Stresses in Individual On-Chip Interconnects Using Synchrotron Nanodiffraction.” Applied Physics Letters 124 (8): 1–6. doi:10.1063/5.0192672.