Soluble Soybean Polysaccharides-Induced Changes in Pasting Properties of Wheat Flour Under Acidic Conditions: From the View of Starch Molecular Structure.

The variation of soluble soybean polysaccharides (SSPS) on pasting properties for wheat flour (WF) under acidic conditions was investigated, and its potential mechanisms were studied from the starch molecular structure changes. The SSPS decreased the pasting viscosity and elastic viscosity modulus of WF under acidic conditions and tightened the immobilized water located in the starch paste network. The ratio of 1047/1022 cm−1 and the relative crystallinity in the WF with SSPS under acidic conditions, compared with the WF sample, decreased from 0.6306 to 0.5672 and from 10.40 to 8.92%, respectively. The SSPS addition increased the thermal stability of WF under acidic conditions. This was agreed with the morphological structure characterization detected by scanning electron microscopy (SEM) and confocal laser scanning microscope (CLSM), which exhibited a more uniform structure in the sample of WF added with SSPS under acidic conditions (WF-SSPS-P). This study promoted a better understanding of the SSPS–starch interactions under acidic conditions in WF, which provided a way to enhance the quality of wheat flour-based products. [ABSTRACT FROM AUTHOR]