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A review on the wettability and residual stress of AMB AlN/metal joints.

Authors :
Cheng, Lin
Liu, Shaohong
Jiang, Bowen
Zhou, Limin
Cui, Hao
Liu, Manmen
Wen, Ming
Wang, Chuanjun
Wang, Wei
Li, Song
Sun, Xudong
Source :
Materials Science in Semiconductor Processing. May2024, Vol. 174, pN.PAG-N.PAG. 1p.
Publication Year :
2024

Abstract

Aluminum nitride (AlN) ceramics possess exceptional comprehensive properties in terms of thermal, electrical, and mechanical aspects. The joining of AlN ceramics with metals enables the full exploitation of the advantages offered by AlN ceramics. Brazing is the most employed method for joining AlN ceramics with metals. However, brazing AlN ceramics to metals is challenging due to the differences in chemical bonding and coefficient of thermal expansion (CTE) between these two materials. This review provides a summary of methods that enhance the wettability and alleviate the residual stress of active metal brazing (AMB) AlN/metal joints. Additionally, it discusses the causes of residual stress and various methods to detect and evaluate the magnitude and distribution of residual stress, with a focus on finite element method (FEM). Finally, it identifies the existing challenges and future directions for further enhancing the wettability and reliability of AMB AlN/metal joints. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
13698001
Volume :
174
Database :
Academic Search Index
Journal :
Materials Science in Semiconductor Processing
Publication Type :
Academic Journal
Accession number :
175698463
Full Text :
https://doi.org/10.1016/j.mssp.2024.108181