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A review on the wettability and residual stress of AMB AlN/metal joints.
- Source :
-
Materials Science in Semiconductor Processing . May2024, Vol. 174, pN.PAG-N.PAG. 1p. - Publication Year :
- 2024
-
Abstract
- Aluminum nitride (AlN) ceramics possess exceptional comprehensive properties in terms of thermal, electrical, and mechanical aspects. The joining of AlN ceramics with metals enables the full exploitation of the advantages offered by AlN ceramics. Brazing is the most employed method for joining AlN ceramics with metals. However, brazing AlN ceramics to metals is challenging due to the differences in chemical bonding and coefficient of thermal expansion (CTE) between these two materials. This review provides a summary of methods that enhance the wettability and alleviate the residual stress of active metal brazing (AMB) AlN/metal joints. Additionally, it discusses the causes of residual stress and various methods to detect and evaluate the magnitude and distribution of residual stress, with a focus on finite element method (FEM). Finally, it identifies the existing challenges and future directions for further enhancing the wettability and reliability of AMB AlN/metal joints. [ABSTRACT FROM AUTHOR]
- Subjects :
- *RESIDUAL stresses
*WETTING
*BRAZING alloys
*ALUMINUM nitride
*METALS
*FILLER metal
Subjects
Details
- Language :
- English
- ISSN :
- 13698001
- Volume :
- 174
- Database :
- Academic Search Index
- Journal :
- Materials Science in Semiconductor Processing
- Publication Type :
- Academic Journal
- Accession number :
- 175698463
- Full Text :
- https://doi.org/10.1016/j.mssp.2024.108181