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Stress mechanism analysis by finite element method for different dielectric films deposited with ion-beam assisted deposition on flexible substrates.

Authors :
Chen, Hsi-Chao
Lu, Yu-Ru
Chang, Chun-Hao
Source :
Thin Solid Films. Mar2024, Vol. 792, pN.PAG-N.PAG. 1p.
Publication Year :
2024

Abstract

• Stress mechanism investigated for the dielectric films of SiO 2 , TiO 2 , Ta 2 O 5 and Nb 2 O 5. • Dielectric films deposited on PET and PC substrate for anisotropic stress investigation. • The anisotropic stress of dielectric films was analyzed with Mohr circle method. • Finite element method numerical simulated intrinsic stress for the dielectric films. • High-order polynomial fitting curvature could reduce the stress error within 2.47 %. In this study, an investigation was made into the optical and stress properties of four dielectric films: silicon dioxide (SiO 2), titanium dioxide (TiO 2), tantalum pentoxide (Ta 2 O 5) and niobium pentoxide (Nb 2 O 5). This was because they are commonly used in the optoelectronic and semiconductor devices. The classification of these stress properties includes tensor & compressive, thermal & intrinsic, and principal & shearing. The stress mechanism of these dielectric films deposited on polyethylene terephthalate (PET) and polycarbonate (PC) flexible substrates with ion-beam assisted deposition (IBAD) was investigated by the finite element method (FEM). Meanwhile, the equivalent room temperature (ERT) of FEM was used for the analysis of the intrinsic stresses, and then the methods of home-made phase-shifting shadow moiré interferometer and Mohr circle were employed to analyze the anisotropic principal and shearing stresses. The results demonstrated that the residual stress of these dielectric films could get broken on the PC flexible substrate. However, only all of the SiO 2 /PC films were measured. Also, the residual stress on PET flexible substrate could change from the tensile stress to the compressive one when the thickness of the film increased. However, only all of the Ta 2 O 5 /PET films got compressed when the film thickness increased. Therefore, the anisotropic stress of the four dielectric films on the PET substrate suggests that both the maximum principal and shearing stresses should be Ta 2 O 5 >TiO 2 ≥Nb 2 O 5 >SiO 2. They are proportion to Q (elastic-energy/mole). The FEM method combined with the high-order polynomial fitting curvature could obtain the intrinsic stress and yield the error within 2.47 %. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
00406090
Volume :
792
Database :
Academic Search Index
Journal :
Thin Solid Films
Publication Type :
Academic Journal
Accession number :
175792815
Full Text :
https://doi.org/10.1016/j.tsf.2024.140244