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Silicon Hybridization for the Preparation of Room-Temperature Curing and High-Temperature-Resistant Epoxy Resin.

Authors :
Rong, Liping
Su, Jiaqi
Li, Zhiguo
Liu, Xiaohui
Zhang, Dayong
Zhu, Jinhua
Li, Xin
Zhao, Ying
Mi, Changhong
Kong, Xianzhi
Wang, Gang
Source :
Polymers (20734360). Mar2024, Vol. 16 Issue 5, p634. 13p.
Publication Year :
2024

Abstract

Specialized epoxy resin, capable of achieving room-temperature profound curing and sustaining prolonged exposure to high-temperature environments, stands as a pivotal material in modern high-end manufacturing sectors including aerospace, marine equipment fabrication, machinery production, and the electronics industry. Herein, a silicon-hybridized epoxy resin, amenable to room-temperature curing and designed for high-temperature applications, was synthesized using a sol–gel methodology with silicate esters and silane coupling agents serving as silicon sources. Resin characterization indicates a uniform distribution of silicon elements in the obtained silicon hybrid epoxy resin. In comparison to the non-hybridized epoxy resin, notable improvements are observed in room-temperature curing performance, heat resistance, and mechanical strength. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
20734360
Volume :
16
Issue :
5
Database :
Academic Search Index
Journal :
Polymers (20734360)
Publication Type :
Academic Journal
Accession number :
175992343
Full Text :
https://doi.org/10.3390/polym16050634