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RTX Works with AMD to Develop Next-Gen Multi-Chip Package.
- Source :
-
Microwave Journal . Apr2024, Vol. 67 Issue 4, p31-31. 1/3p. - Publication Year :
- 2024
-
Abstract
- The article focuses on Raytheon's collaboration with AMD and other industry partners to develop a next-generation multi-chip package for sensors, aiming to enhance RF energy conversion to digital information. Topics include the contract awarded to Raytheon, the integration of state-of-the-art commercial devices, and the expected outcomes of the collaboration in terms of system capabilities for defense applications.
- Subjects :
- *MILITARY technology
*HIGH technology
Subjects
Details
- Language :
- English
- ISSN :
- 01926225
- Volume :
- 67
- Issue :
- 4
- Database :
- Academic Search Index
- Journal :
- Microwave Journal
- Publication Type :
- Periodical
- Accession number :
- 176709736