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RTX Works with AMD to Develop Next-Gen Multi-Chip Package.

Authors :
Drubin, Cliff
Source :
Microwave Journal. Apr2024, Vol. 67 Issue 4, p31-31. 1/3p.
Publication Year :
2024

Abstract

The article focuses on Raytheon's collaboration with AMD and other industry partners to develop a next-generation multi-chip package for sensors, aiming to enhance RF energy conversion to digital information. Topics include the contract awarded to Raytheon, the integration of state-of-the-art commercial devices, and the expected outcomes of the collaboration in terms of system capabilities for defense applications.

Details

Language :
English
ISSN :
01926225
Volume :
67
Issue :
4
Database :
Academic Search Index
Journal :
Microwave Journal
Publication Type :
Periodical
Accession number :
176709736