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SCANNING THERMAL MICROSCOPY FOR LOCALIZING AND MONITORING DEFECTS IN ELECTRONICS.
- Source :
-
Electronic Device Failure Analysis . May2024, Vol. 26 Issue 2, p4-8. 5p. - Publication Year :
- 2024
-
Abstract
- The article discusses the application of scanning thermal microscopy (SThM) for localizing and monitoring defects in electronics, emphasizing its role in thermal management, defect detection, and performance improvement of microelectronic technologies. It introduces the principle of SThM instruments, describes their operation in passive and active modes, and highlights their capabilities in detecting localized inhomogeneities and overheating in electronic components.
Details
- Language :
- English
- ISSN :
- 15370755
- Volume :
- 26
- Issue :
- 2
- Database :
- Academic Search Index
- Journal :
- Electronic Device Failure Analysis
- Publication Type :
- Academic Journal
- Accession number :
- 177092342
- Full Text :
- https://doi.org/10.31399/asm.edfa.2024-2.p004