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SCANNING THERMAL MICROSCOPY FOR LOCALIZING AND MONITORING DEFECTS IN ELECTRONICS.

Authors :
Gomès, Séverine
Source :
Electronic Device Failure Analysis. May2024, Vol. 26 Issue 2, p4-8. 5p.
Publication Year :
2024

Abstract

The article discusses the application of scanning thermal microscopy (SThM) for localizing and monitoring defects in electronics, emphasizing its role in thermal management, defect detection, and performance improvement of microelectronic technologies. It introduces the principle of SThM instruments, describes their operation in passive and active modes, and highlights their capabilities in detecting localized inhomogeneities and overheating in electronic components.

Details

Language :
English
ISSN :
15370755
Volume :
26
Issue :
2
Database :
Academic Search Index
Journal :
Electronic Device Failure Analysis
Publication Type :
Academic Journal
Accession number :
177092342
Full Text :
https://doi.org/10.31399/asm.edfa.2024-2.p004