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Precise Fermi level engineering in a topological Weyl semimetal via fast ion implantation.

Authors :
Mandal, Manasi
Chotrattanapituk, Abhijatmedhi
Woller, Kevin
Wu, Lijun
Xu, Haowei
Hung, Nguyen Tuan
Mao, Nannan
Okabe, Ryotaro
Boonkird, Artittaya
Nguyen, Thanh
Drucker, Nathan C.
Chen, Xiaoqian M.
Momiki, Takashi
Li, Ju
Kong, Jing
Zhu, Yimei
Li, Mingda
Source :
Applied Physics Reviews. Jun2024, Vol. 11 Issue 2, p1-8. 8p.
Publication Year :
2024

Abstract

The precise controllability of the Fermi level is a critical aspect of quantum materials. For topological Weyl semimetals, there is a pressing need to fine-tune the Fermi level to the Weyl nodes and unlock exotic electronic and optoelectronic effects associated with the divergent Berry curvature. However, in contrast to two-dimensional materials, where the Fermi level can be controlled through various techniques, the situation for bulk crystals beyond laborious chemical doping poses significant challenges. Here, we report the milli-electron-volt (meV) level ultra-fine-tuning of the Fermi level of bulk topological Weyl semimetal tantalum phosphide using accelerator-based high-energy hydrogen implantation and theory-driven planning. By calculating the desired carrier density and controlling the accelerator profiles, the Fermi level can be experimentally fine-tuned from 5 meV below, to 3.8 meV below, to 3.2 meV above the Weyl nodes. High-resolution transmission electron microscopy reveals the crystalline structure is largely maintained under irradiation, while electrical transport indicates that Weyl nodes are preserved and carrier mobility is also largely retained. Our work demonstrates the viability of this generic approach to tune the Fermi level in semimetal systems and could serve to achieve property fine-tuning for other bulk quantum materials with ultrahigh precision. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
19319401
Volume :
11
Issue :
2
Database :
Academic Search Index
Journal :
Applied Physics Reviews
Publication Type :
Academic Journal
Accession number :
178180504
Full Text :
https://doi.org/10.1063/5.0181361