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Advances in magnetic fluid seal and structures.

Authors :
Zeng, Qun-feng
Deng, Zuowei
Li, Jiachen
Zhang, Wenling
Source :
Journal of Magnetism & Magnetic Materials. Aug2024, Vol. 603, pN.PAG-N.PAG. 1p.
Publication Year :
2024

Abstract

[Display omitted] • The research progress of magnetic fluid in vacuum, gas, liquid and dust prevention is reviewed. • The magnetic fluid component materials are introduced, including sealing characteristics, liquid–liquid interface stability, simulation analysis and structural design. • The future development in the field of magnetic fluid seals is envisioned. Magnetic fluids(MF) are stable colloidal solution systems consisting of a mixture of nanoscale magnetic particles, surfactants, and a base carrier fluid. Magnetic fluid sealing(MFS) technology has been widely used in gas and vacuum conditions, and research on liquid seals is also receiving increasing attention. Magnetic fluid seals have many advantages, such as "zero" leakage, green environmental protection, long service life, reliability and stability. The current review on the subject is limited to the form of magneto-fluidic applications, and there is no clear description of the specific structure and classification. In this paper, the research progress of magnetic fluid in the field of vacuum, gas, liquid and dust prevention is reviewed, and the magnetic fluid component materials are introduced in a categorized and summarized way, including sealing characteristics, liquid–liquid interface stability, simulation analysis and structural design. Finally, the future development in the field of magnetic fluid seals is envisioned. In the future, the magnetic fluid sealing technology is expected to further innovate and develop, bringing more breakthrough solutions to the sealing field. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
03048853
Volume :
603
Database :
Academic Search Index
Journal :
Journal of Magnetism & Magnetic Materials
Publication Type :
Academic Journal
Accession number :
178210217
Full Text :
https://doi.org/10.1016/j.jmmm.2024.172232