Cite
Microwave Characterization and Modeling of High Aspect Ratio Through-Wafer Interconnect Vias in Silicon Substrates.
MLA
Lydia Lap Wai Leung, and Kevin J. Chen. “Microwave Characterization and Modeling of High Aspect Ratio Through-Wafer Interconnect Vias in Silicon Substrates.” IEEE Transactions on Microwave Theory & Techniques, vol. 53, no. 8, Aug. 2005, pp. 2472–80. EBSCOhost, https://doi.org/10.1109/TMTT.2005.852782.
APA
Lydia Lap Wai Leung, & Chen, K. J. (2005). Microwave Characterization and Modeling of High Aspect Ratio Through-Wafer Interconnect Vias in Silicon Substrates. IEEE Transactions on Microwave Theory & Techniques, 53(8), 2472–2480. https://doi.org/10.1109/TMTT.2005.852782
Chicago
Lydia Lap Wai Leung, and Kevin J. Chen. 2005. “Microwave Characterization and Modeling of High Aspect Ratio Through-Wafer Interconnect Vias in Silicon Substrates.” IEEE Transactions on Microwave Theory & Techniques 53 (8): 2472–80. doi:10.1109/TMTT.2005.852782.