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Materials and Designs for Extremely Efficient Encapsulation of Soft, Biodegradable Electronics.

Authors :
Ko, Gwan‐Jin
Kang, Heeseok
Han, Won Bae
Dutta, Ankan
Shin, Jeong‐Woong
Jang, Tae‐Min
Han, Sungkeun
Lim, Jun Hyeon
Eom, Chan‐Hwi
Choi, So Jeong
Ryu, Yelynn
Yeo, Woon‐Hong
Cheng, Huanyu
Hwang, Suk‐Won
Source :
Advanced Functional Materials. 9/25/2024, Vol. 34 Issue 39, p1-9. 9p.
Publication Year :
2024

Abstract

Effective encapsulation is essential for reliable operation of bio‐integrated electronics, particularly those containing dissolvable elements, under humid environments for desired periods of time; however, conventional inorganic or organic encapsulants often suffer from tissue‐incompatible mechanical rigidity and insufficient water‐barrier performance. Here, a mechanically resilient and efficient encapsulation strategy is proposed that can exceed a functional lifetime of state‐of‐the‐art soft encapsulations by several tens of magnitudes. The exceptional protection arises from the high aspect ratio of dissolvable yet impermeable inorganic fillers embedded within biodegradable polymers, which significantly extend the diffusion length of biofluids or water components. Theoretical modeling and experimental analysis elucidate the effects of types, shapes, and concentrations of the fillers on encapsulation performance, as well as mechanical/physical properties. The operation of electronic components under aqueous solutions for prolonged periods demonstrates the practical feasibility of the encapsulation approach for versatile types of soft, biodegradable electronics. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
1616301X
Volume :
34
Issue :
39
Database :
Academic Search Index
Journal :
Advanced Functional Materials
Publication Type :
Academic Journal
Accession number :
179944692
Full Text :
https://doi.org/10.1002/adfm.202403427