Experimental study of thermal contact resistance using different thermal interface materials across similar metallic pairs.

Thermal conductivity is an important property for heat-related applications. The presence of roughness, waves, uneven surfaces and gaps between surfaces can lead to decreased thermal conductivity, which is affected by thermal contact resistance. As a result of this, this experimental study came to investigate this resistance through similar metal pairs, using different thermal interface materials (air, copper foil, press foil, aluminum foil) and using different weight loads (1, 2, and 3 kg). The work was carried out in two stages in the first stage. Manufacture and assembly of an integrated heat conduction system that complies with American standards (ASTM D 5470). Samples of aluminum, copper, and brass in cylindrical shape (diameter 2 cm and length 5 cm) were used. The work was carried out at different temperatures up to 70 °C, which is the thermal equilibrium temperature for all readings recorded for this work. Four experiments were also conducted for each identical metal pair using different interfacial materials (air, aluminum foil, and copper foil) and applying loads with different weights (no weight, 1 kg, 2 kg, and 3 kg). Clear results were obtained that showed that using different loads had the effect of reducing thermal contact resistance in all cases by increasing the contact points. [ABSTRACT FROM AUTHOR]