Improving interfacial thermal transport in silicon-reinforced epoxy resin composites with self-assembled monolayers.

[Display omitted] • SAM-NH 2 improves interfacial thermal conductance by 140% in EP/Si systems. • Bilateral covalent bonds enhance interfacial adhesion and phonon matching. • Interfacial adhesion strength can improve interfacial heat transport. • Single side covalent bond may reduce interface heat transport. Epoxy resin (EP) based composite materials, due to their advantages such as light weight, ease of processing, and mechanical properties, have been widely applied across thermal packaging field. However, the overall thermal conductivity is constrained by the interfacial thermal resistance between the filler and the substrate. Existing studies suggest that self-assembled monolayers (SAM) can enhance the interfacial thermal conductance (ITC) by forming covalent bonds. Nevertheless, limited research has focused on using SAM to form bilateral covalent bonds to regulate ITC. Therefore, SAM capable of forming bilateral covalent bonds at the EP/silicon (Si) interface were employed to enhance ITC. In this study, time-domain thermoreflectance (TDTR) experiments and molecular dynamics (MD) simulations were conducted to investigate the EP/SAM/Si system. The results demonstrate that SAM-NH 2 modification, which forms bilateral covalent bonds at the EP/Si interface, increased the interfacial adhesion strength and enhanced ITC to 140%, thereby significantly promoting interfacial heat transfer. Conversely, ITC was reduced with SAM-CH 3 due to the formation of single covalent bond. Subsequently, the differential effective medium (DEM) model was used to determine that the thermal conductivity of the composite modified with SAM-NH 2 was improved by 11%. This study provides new insights into adjusting ITC using SAM. [ABSTRACT FROM AUTHOR]