The Stability Evaluation of Ceria Slurry Using Polymer Dispersants with Varying Contents for Chemical Mechanical Polishing Process.

MLA

Hwang, Sohee, et al. “The Stability Evaluation of Ceria Slurry Using Polymer Dispersants with Varying Contents for Chemical Mechanical Polishing Process.” Polymers (20734360), vol. 16, no. 24, Dec. 2024, p. 3593. EBSCOhost, https://doi.org/10.3390/polym16243593.

APA

Hwang, S., Park, J., & Kim, W. (2024). The Stability Evaluation of Ceria Slurry Using Polymer Dispersants with Varying Contents for Chemical Mechanical Polishing Process. Polymers (20734360), 16(24), 3593. https://doi.org/10.3390/polym16243593

Chicago

Hwang, Sohee, Jihee Park, and Woonjung Kim. 2024. “The Stability Evaluation of Ceria Slurry Using Polymer Dispersants with Varying Contents for Chemical Mechanical Polishing Process.” Polymers (20734360) 16 (24): 3593. doi:10.3390/polym16243593.