Cobalt‐Ion Superhygroscopic Hydrogels Serve as Chip Heat Sinks Achieving a 5 °C Temperature Reduction via Evaporative Cooling.

MLA

Xi, Mufeng, et al. “Cobalt‐Ion Superhygroscopic Hydrogels Serve as Chip Heat Sinks Achieving a 5 °C Temperature Reduction via Evaporative Cooling.” Small Methods, vol. 8, no. 12, Dec. 2024, pp. 1–9. EBSCOhost, https://doi.org/10.1002/smtd.202301753.

APA

Xi, M., Zhang, X., Liu, H., Xu, B., Zheng, Y., Du, Y., Yang, L., & Ravi, S. K. (2024). Cobalt‐Ion Superhygroscopic Hydrogels Serve as Chip Heat Sinks Achieving a 5 °C Temperature Reduction via Evaporative Cooling. Small Methods, 8(12), 1–9. https://doi.org/10.1002/smtd.202301753

Chicago

Xi, Mufeng, Xiaohu Zhang, Hong Liu, Bolin Xu, Yongliang Zheng, Yujie Du, Lin Yang, and Sai Kishore Ravi. 2024. “Cobalt‐Ion Superhygroscopic Hydrogels Serve as Chip Heat Sinks Achieving a 5 °C Temperature Reduction via Evaporative Cooling.” Small Methods 8 (12): 1–9. doi:10.1002/smtd.202301753.